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PTH Size and Finish Follow the press-fit connector manufacturer s recommendation for PTH finished hole size, tolerances, and acceptable or tested surface finishes. Use cross-section sample boards with high-aspect-ratio (depth:diameter) holes to qualify the PWB vendor and determine typical PTH barrel profile. Ensure that wall thickness of plated through-holes are uniform throughout their depth and meet connector specifications. Make certain that the surface finish on the PTH annular ring does not interfere with insertion of the compliant press-fit pin.

Use a Proper Press Use of an electromechanical press is recommended for best precision and process feedback. Its precision and feedback mechanisms will minimize the impact on the PWB, or connector.

Check Pins for Straightness Prior to insertion into the board, check press-fit connector pins for straightness and integrity. An inexpensive go/no-go gauge (see Fig. 49.14) can be machined to check that connector pins are not bent. It should be constructed so that it neither compresses the compliant section of the press-fit pin nor damages its surface coating. This is especially helpful for fine-pitch press-fit connectors (1 mm centers) and is better than relying on visual inspection for pin field integrity.

Column PortB Driver (Current source) (Anodes)

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MEMS devices are made in a fashion similar to computer microchips and electronics components The advantage of this manufacturing process is not simply that small structures can be achieved but also that thousands or even millions of system elements can be fabricated simultaneously [3] This allows systems to be both highly complex and of an extremely low cost of between US$ 4 and US$ 10 per unit of sensor for automobiles [6] Microstructures are usually made by using three distinct microfabrication processes, namely, surface micromachining, bulk micromachining and the LIGA process Methods such as photolithography, material deposition, chemical etching, electroplating and X-ray radiation are often employed to shape mechanical and electronic structures The use of anisotropic etching techniques allows the fabrication of devices with well-defined walls and high aspect ratios [16] The aspect ratio is defined as the ratio of the height of a mechanical structure perpendicular to the substrate width of the minimum feature of the device as shown in Figure 831 [2]

FIGURE 49.14 Gauge for checking connector pin position prior to pressing. This is best used for high lead count, fine-pitch pin press-fit connectors.

Keep the Press-Fit PTH Clear of Foreign Material Protect press-fit PTH holes from extraneous solder, flux, surface-mount adhesive, spot mask, or other contaminants from surface-mount, wave-solder, or hand-solder processes. Use of a wave pallet or high-temperature masking tape (e.g., polyimide tape) to shield press-fit locations during other processing is advisable. If tape is used, inspect first articles to ensure that high-temperature masking tape residue does not foul press-fit holes. Polyimide tape with acrylic-based adhesive is best for this application, as residues will be absent or minimal.

Use the Proper Press Tooling Use hardened-steel pressing tools as sold or recommended by connector manufacturer to avoid damage to the connector or the PCA.

Provide Proper Board Support Adequately support the PCA during the pressing operation so that connectors can be fully homed and that the board is not overflexed. Excessive board flexure may cause solder-joint cracking, broken PWB circuit traces, and board delamination. This is especially important for the characteristically inflexible ball-or column-based solder joints of area-array devices such as BGAs and CCGAs. The best support will be localized directly under the connector to be pressed. Ensure that the support includes clearance for backside pin protrusion; otherwise, pins will stub and bend on the supporting anvil. Support tooling design should carry appropriate relief features for bottomside components.

Connector Inspection Check the connector after pressing for even bottomside pin protrusion, topside connector body seating height, damage to the connector body, inaccurate mating pin positions (within the connector as opposed to within the board), damage, or movement of electrical shields if the connector is so equipped.

Fig 831: The definition of aspect ratio [4]

PCA Inspection Check the PCA for surface damage in the area of the pressing operation. A mispositioned or damaged press tool or board support can damage components or overly compress the laminate causing outer- or innerlayer trace damage. Look for errant tooling marks on the PWB surface after the press-fitting operation. Overcompression of the board can lead to compressed or severed traces within the board. A compressed trace may impact current capacity and result in localized circuit overheating or otherwise impact signal integrity.

1 2 3 4

Solder Sliver Inspection Check the bottomside of the board for solder sliver formation. This is especially relevant in the case of HASL boards. Brush these out if required and inspect. Loose slivers may cause electrical shorting on the board or other boards within the system enclosure. Work with the

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